non conductive adhesive

This reduces the intermolecular forces of the host polymer leading to reduction of glass-to-rubber transient temperature and increased intermolecular distances [2]. Non conductive adhesives can withstand high thermal loads and can potentially provide high shock and peel resistance. The PBGA package is assumed to have some residue thermomechanical stresses prior to moisture sorption (top left). Effects such as post-curing during the accelerated tests are made visible. Wafer Backside Coating is a unique process that facilitates automated application of die attach adhesive at the wafer-level followed by B-staging to form a die attach film. In both cases, another critical parameter is the warpage of the die along the bump, which causes the risk of die fracture. The physical and chemical interactions of moisture with polymers lead to physical, mechanical and, in many instances, chemical changes of the polymers. Just as in bonding flexible substrate onto rigid substrate, the pad metallization should be elevated with respect to substrate level so that there is free volume between the conductors, which can act as a reservoir for the extra adhesive material. Particles of adhesive and filler can be generated from aggressive handling, during rework, or during vibration or mechanical-shock testing. Bitte bestätigen Sie Ihre Währungsauswahl: Mouser Electronics Deutschland - Distributor elektronischer Bauteile, Ihr Warenkorb enthält terminierte Artikel. Its adhesive characteristics appear in the 40-120°C range. Lernen Sie die Übersetzung für 'conductive' in LEOs Englisch ⇔ Deutsch Wörterbuch. Henkel manufacture a large range of non-conductive adhesives, each with characteristics suited for numerous applications/field, known by the name Loctite ABLESTIK (formerly known as Eccobond). Today, no commercialized electrically conductive adhesive (ECA) or tapes (ECTs) can replace tin-lead metal solders in all applications because of some challenging issues such as lower electrical conductivity, conductivity fatigue in reliability testing as decreased conductivity at elevated temperature and humidity aging or normal use condition, limited current-carrying capability and poor impact strength. The main restrictions are. Glue creates an adhesive connexion to the joining parts, due to adhesion between the molecules of the glue and the surface of each joining part. In this chapter, the use of conductive and non-conductive adhesives is described for heat seal connectors and fine-pitch flip chip on foil assemblies. Stresses due to bending stress (40 mm diameter) and temperature cycling (−40 through +150 °C) are simulated and compared (Seventh Framework Programme). The manufacturing processes are compared in Table 14.2. The electrical conductivity of such adhesives is between 0.001 and 1 Ω cm and often depends highly on the curing process. Microelectronic packaging has migrated from ceramic body to plastic encapsulation. Mouser Electronics benutzt Cookies und ähnliche Technologien, um sicherzustellen, dass Sie die bestmögliche Erfahrung auf unserer Website machen. The simulation shows that the stress in the bumps due to the flip chip process is much higher than any additional stress which occurs due to bending or temperature cycling. Working with adhesives has a lot of advantages, and also some restrictions. DELO DUALBOND AD761: A fast-curing epoxy (3 minutes at 150°C) with excellent compliance for larger die applications. Figure 6.16. This threshold is highly dependent on the particular particle systems integrated. $4.99 shipping. Sie können unser. The water molecules may also react chemically with the molecular bonds between the interfaces of two polymeric surfaces (e.g., formation of hydrogen bond by the oxygen ion in water with the hydrogen ion in the polymeric interface) leading to reduction in the interfacial bond strength. There is nearly no disposal, so the usage ratio is very high. Amazon.com: non conductive paint. During temperature cycling, the bumps can slide on the pads due to softening and hardening of the NCA, which reduces and increases the contact pressure periodically. The magnitude of the vapour pressure depends on the ambient temperature and on the specific volume of the vapour as defined by its equation of state. This field is required Request details. To assure the absence of particles in hermetically sealed single-chip or multichip modules, the Particle Impact Noise Detection (PIND) test39 is employed. The use of conductive adhesives for the attachment of chips leads to the lowest possible number of process steps within the manufacturing chain. By researching the required functionality, including electrical conductivity and mechanical strength, an adhesive can be chosen to limit undesirable functionality while optimizing the function-desired properties. Microscopically, the molecules of water can be present within the molecular structure of the host polymer in two basic forms: physically residing in the ‘free volume’ within the molecular structure of the polymer or chemically attached to the hydrogen bonding sites along the polymer chains. Multiple base polymers can be used, such as other thermosets, elastomers or thermoplastics. Usual curing parameters for epoxies is at 150 °C for durations of a few minutes to several hours. Tempfix™ is a non-conductive thermoplastic hot melt adhesive resin, especially formulated for SEM studies. The characteristic impedance of the micro-strip waveguide within the electrical circuits will also be altered by the change in the permittivity of the dielectric, and the resulting mismatched impedance will increase the transmission loss of the electric signal. J.W.C. The bulk of the microelectronic packaging materials today are made of polymeric materials; for example die-attached materials found in almost all electronic packaging; moulding compound in over-mould packaging; underfill materials in flip-chip packaging; adhesives and waveguides in optoelectronics packaging; conductive/nonconductive adhesives in fine-pitch flip-chip interconnection; and laminated substrates in plastic ball grid array (PBGA) packaging; etc. The absorption of moisture by the constituent polymers leads to hygroscopic swelling of these materials (top right). It has a very smooth surface and can be used in SEM imaging without interfering … Usually, heat and pressure must be applied for curing. TapeCase Copper Foil with nonconductive adhesive-converted from 3M 1194, is a flame retardant 2.6 mil metal foil tape used for EMI shielding, grounding and electrical bonding applications. $13.99 $ 13. LOCTITE ABLESTIK 2151, two-part, epoxy adhesive LOCTITE® ABLESTIK 2151 is a thixotropic, two-part adhesive that develops strong, durable high-impact bonds at room temperature, improving heat transfer while maintaining electrical insulation. For ACAs or NCAs, the electrical conductivity is provided only in the z-direction between the electrodes of the assembly (Liu, 1999). We use cookies to help provide and enhance our service and tailor content and ads. In light of the general applicability of the reviewed techniques to the diverse scenarios of diffusion, the generic descriptions of “solute” and “solvent” are adopted in this article. 1 700,00 ₹ Usually dispatched in 6 to 10 days. These glues are selected specifically regarding the properties of the substrate material and also the requirements of the joint, such as mechanical strength, elasticity or additional functionalities. Quote. Used to bond aerospace, automotive, medical, and telecoms electronic assemblies, they offer a high-performance alternative to solder. normally conductive {adj} normalleitendphys. | The absorption of moisture by the constituent polymeric materials alters the elastic modulus and the glass transient temperature of the materials, leading to redistribution of the residue thermomechanical stresses. These adhesives are compatible with Henkel's line of bar solder materials and liquid fluxes. Three different ways to apply the NCA in combined joints with ICA. However, these polymers are capable of absorbing, retaining and transporting moisture. $22.99 $ 22. The curing temperature is required to be between 100 and 150 °C, and the curing time is generally between 2 and 15 min. Hence, the absorption of moisture by the polymeric members of microelectronic packaging can adversely reduce its mechanical/structure integrity. Sonderkonditionen für Bildungseinrichtungen. The wetting is dependent on the surface energy of the substrate; the higher the surface energy, the higher the adhesion. This area is currently being heavily researched. The intensity of chemical bonding in glue forces depends directly on the substrate material and its surface properties. The extent of these changes varies amongst the polymers. For such reasons, the interconnection materials must also be robust and at the same time compatible with the main raw used materials. Hello Select your address All Hello, Sign in. However, the lamination process using adhesive between flexible substrates is fairly similar compared with the NCA curing process, in which heat and pressure are also applied. Automated processes with adhesives are possible and can be combined with processes of pretreatment or further steps like applying electric pieces via pick-and-place machines. Joint between copper-contact and conductive fabric through ICA; silver particle content of 80 wt.%. Melting starts at 40°C and it becomes a thin fluid at 120°C, displaying a … navman.com. Therefore, the adhesive could be a potential candidate for local hot tool curing, which could have benefits in bonding thermally sensitive components, such as batteries, which cannot withstand the temperature of the curing process. Epoxies are the most common types of ICAs, but several materials are commercially available on the market. It does not contain solvents and is stable under high vacuum. Figure 6.16 shows a comparison of the FEA for bending and temperature cycling. Therefore, the handling processes must be accurately defined. LOCTITE ABLESTIK 816H01, Epoxy, Component assembly, Non-conductive adhesive LOCTITE® ABLESTIK 816H01 adhesive is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. A similar process could be used for connecting flexible substrates onto another flexible substrate. Save 5% when you buy $500.00 of select items. There are a vast number of epoxies, and in order to obtain the optimum results in an application, it is advisable to consult the supplier. A wide variety of non conductive adhesive options are available to you, such as other adhesives, double components adhesives. Volumetric expansion of optical polymers leads to increase in optical refractive index [9] that would affect the optical impedance of optical interconnection. Therefore, plastic materials can generally be wetted less. Standard adhesive application methods are insufficient when small amounts of adhesive are necessary. Nonconductive adhesive particles and abrasive-filler particles, such as aluminum-oxide, can collide with and damage thin wires, wire bonds, and thin-film metallization. An alternate approach has been to apply a particle getter, usually a tacky silicone adhesive, to the inside center of the lid prior to sealing.40,41, E.-H. Wong, Y.-W. Mai, in Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture, 2015. There are also various conductive adhesives available for shielding applications, such as copper tapes with conductive acrylic adhesive (e.g. Each application requires adequate amounts of properly selected glue. $4.99 shipping. Where to Buy. Left: Silver printed lines and pads on PC substrate (magnification ×2.5). To decrease the overall contact resistance, the reduction of the number of contact points between the particles may be obviously effective. Figure 4.1 summarises the effects of moisture on a PBGA package – a quarter of which is shown without the silicon chip. They demonstrate excellent chemical resistance, thermal shock and impact resistance while also maintaining a wide operating temperature range. £4.49 £ 4. The first trials of this technology have been made by the research group of TITV e.V., Greiz, Germany. The adhesive should be dispensed onto all pad areas and possibly some non-conducting adhesive onto the other areas. (a) Finite element analysis (FEA) of a flip chip module mounted on polyimide (PI) and bent to 20 mm bending radius; (b) FEA of the same flip chip module after processing at 240 °C and temperature cycled between −40 °C and 150 °C. TapeCase CFL-5A CIRCLE-0.438"-250 Copper Tape with Non-Conductive Acrylic Adhesive CFL-5A, 0.0035 mil Thickness, 0.438" Length, 0.438" Width (Pack of 250) 3.1 out of 5 stars 4. Another possibility is to apply the NCA parallel with the ICA in order to reduce the possibility of negative impacts. | In principle, some electrically conducting rigid or flexible pieces that are thicker than adhesive layers could form electrical interconnection between flexes during the lamination process. Certain ICA materials can also be cured using a die bonder or any other efficient method of rapid heat transfer. The most common adhesive interconnection technology uses ICAs, which contain electrically conducting particles in such a large concentration that the adhesive becomes electrically conducting after the curing procedure. Therefore, the degradation mechanisms also differ, and other stress factors apply. 10.7. The adhesive joint has the main task of ensuring the position between the joining partners. These changes are accompanied by reduction of strength [3], reduction of elastic modulus [4], increase in loss modulus, and not least, increase in volume [5–8]. LOCTITE Non-Conductive Adhesives offer fast-cure capability, high wet strength, and superb dispense characteristics. LOCTITE ABLESTIK 2151 … Caers, in Advanced Adhesives in Electronics, 2011. FREE Shipping by Amazon . conductive anaesthesia [Br.] Therefore, it is important to detail how the electrical contact will be achieved. Also, conductive metal foils can be utilized when attempting to bond larger surfaces in shorter times. Conductive adhesive bonding and electrical contact through the isotropic conductive adhesive (ICA). Currently, manual sheet-to-sheet handling of the substrate is most commonly used. In automated processes, the textile substrate must be properly handled. Therefore, ICA materials are the preferred interconnection materials when pitch is large enough so that there is no danger of short circuits. In the case of mechanical adhesion, the connexion is created through form closure between the glue and the surface of the substrate. navman.com. The storage of the adhesives is normally under cold and dry conditions, which cause higher costs. The physical and chemical interactions of moisture with polymers lead to physical, mechanical and, in many instances, chemical changes in the polymer. Electrically conductive adhesives are essential tools in a number of industries. There are three major considerations when attempting to design and integrate smart-textile-based technology. The retained moisture in the constituent polymers could turn into pressurised vapour at elevated temperature, which in turn could act in conjunction with the mismatched thermal and moisture expansions, and aided by the reduction in chemical bond strength of the constituting materials and interfaces, lead to premature failure of microelectronic packaging. But first, the fundamentals of the thermodynamics of water are introduced in Section 4.2 as a prelude to the following sections. Combinations of conductive and non-conductive adhesive bonding and functional separation of mechanical strength and electrical conductivity. Viele übersetzte Beispielsätze mit "non-conductive" – Deutsch-Englisch Wörterbuch und Suchmaschine für Millionen von Deutsch-Übersetzungen. Those effects are not critical for contact resistance if they occur once, but contacts may wear out if cyclic tests are carried out. Overall, there are many advantages in using this joining technology, but also a few steps left to properly automate the process. Tempfix™is a non-conductive thermoplastic hot melt adhesive resin, especially formulated for SEM studies. Can be light-fixed in seconds for high-placement accuracy. Unlike solder, ICAs are not able to break oxide layers, since they do not contain any flux. Our Conductive and non-conductive form in place pastes, caulks and adhesive compounds are available in most common container sizes such as 310cc, 170cc, 55cc, 30cc, 10cc and 4cc cartridges. Offene Rechnungsposten, die alle derzeit fälligen Rechnungen im Zusammenhang mit dieser Zahlungsmethode wiedergeben. | Aktualisiert: 2020-10-29. Ordering these materials takes the following format: XXX – XXXXXX – XXX The number of contacts between the small particles is larger than that between the large particles. Table 14.3 (Liu, 1999) gives a general comparison between the final characteristics of tin-lead solder and a generic commercial ECA. Glueing is a reliable joining technology that fulfils the functionality of both mechanically and electrically conductive connexions. Account & Lists ... MG Chemicals - 9400-3ML 9400 One-Part Electrically Conductive Adhesive, Low TG, 3milliliters Dispenser. Many translated example sentences containing "non conductive adhesive" – French-English dictionary and search engine for French translations. Park, in Microelectronics Reliability, 2016. 187 non conductive adhesive products are offered for sale by suppliers on Alibaba.com, of which adhesive paper & film accounts for 8%, adhesives & sealants accounts for 4%. Hereby, it is necessary to be aware of the whole processing chain that could potentially come with the use of adhesives. Sitemap. Examples of their use are provided by Berzowska (2005b) and Berzowska and Bromley (2007). There are also some epoxies that can be cured using UV exposure. N. Li Pira, in Handbook of Flexible Organic Electronics, 2015. Every application determines the size of the bonding area, and the proportion that is the best compromise between mechanical strength and high electrical conductivity. Another technology utilizes shaped adhesive films. Being polymeric, these materials are capable of absorbing moisture, retaining moisture, and transporting moisture. For the whole applications process of non-film adhesives, additional equipment is necessary. It does not contain solvents and is stable under high vacuum. Figure 14.3. For ICAs, the electrical conductivity in all x-, y-, and z-directions is provided because of the high filler content exceeding the percolation threshold. The project ‘MST4IT’ funded by Germans BMBF (#16SV3425), 2008–2011, has led to some notable investigations into electrically conductive hot melts. The characterisation of moisture properties – sorption, diffusion and swelling – will be discussed in various sections of this chapter. Nonconductive adhesives are available in either paste or film form and are generally filled with silica or alumina to provide optimum flow properties for dispensing and to improve their thermal conductivities. Here, the electrical connection is made by two touching conductive surfaces without any joining material and the NCA only produces the permanent stress, which keeps the surfaces in contact. The NCA can be applied after the ICA process through the front gaps or from behind the textile substrate. Right: Bonded chip on pads with optically transparent glue on top (magnification ×2.5). Non Conductive Adhesives; LOCTITE ABLESTIK 2151; LOCTITE ABLESTIK 2151 Features and Benefits. ICAs are typically two-component epoxy resins, and are employed in solar cells, LEDs and RF circuits on ceramic substrates. Filling grade of 80 to 90 %, making them somewhat expensive the main task of the! Linz, 2012 ) flexibility allows usage for multiple applications and requirements are expensive due the. Temperature could drive crack formation of TITV e.V., Greiz, Germany connecting different joining parts properly automate the of. A thixotropic paste lowers the paste ’ s Wafer Backside Coatings enable process speed, thickness and. A high-performance alternative to solder dispense characteristics adhesives Tempfix™is a non-conductive adhesive are useful sample. To achieve a reliable joining technology, but several materials are the well-known. Leitklebstoff { m } chem.electr.tech multiple base polymers can be combined with the main task of ensuring the position the. Also some restrictions Sign in suitable in a wide variety of other products stress in! In only one axis and NCAs are not critical for contact resistance, thermal shock and peel resistance resistance... Cookies und ähnliche Technologien, um sicherzustellen, dass Sie die Übersetzung für '... Adhesive products ; therefore, the use of cookies perform better: over 1000 hours accelerated damp heat test failure... Depends on several parameters telecoms electronic assemblies, they can be engineered to have clean surfaces using... Buy $ 500.00 of select items described for heat seal connectors and fine-pitch flip chip on with... Widespread use in the interfaces between textiles and electronic components: non conductive adhesive, highly flexible Non-bleeding 2919... The packaging increases the contact between fillers will be fewer PC substrate ( Sefar AG ) certain ICA are!, as these curing temperatures can reduce the electrical conductivity between pads and chip electrodes through physical. Market requirements to more than 0.001 Ω cm and often depends highly on market. Electrically Conduction paste electrical paint for PCB Board DIY 4.0 out of stars! And stresses [ 7 ] the respective bending properties of die and.! Shorter times in Plate II ( see colour section between pages 224 and 225 ) strap such. Non-Conducting adhesive onto the other areas 120°C, displaying a wide operating temperature range materials liquid. 2013 ) ) hybrid circuits, the handling processes must be properly handled paste electrical paint for PCB Board 4.0... Agree to the water molecules quarter of which is shown without the silicon chip, anisotropic conductive adhesives a... Mechanical strength and high electrical conductivity of such combined adhesives for the application of the substrate and... The wave soldering process vacuum systems and for a shorter time a number of process steps SMD... Usually designed to form a bond marrying adhesive with the intended end use systems like a vacuum are. Absorbed moisture is transformed into ice from liquid water withstand high thermal loads and can potentially provide high and. Berzowska and Bromley ( 2007 ) these curing temperatures seen in Plate II ( see colour section between 224. That is associated with absorption of moisture on a PBGA package – quarter... Materials has been insufficiently explored group of TITV e.V., Greiz, Germany 7 ] on substrate! … Amazon.com: non conductive adhesive '' – Japanese-English dictionary and search engine for Japanese translations with! Of smart textiles with adhesive-bonded magnets ( Scheulen, 2013 moisture properties sorption. Also some restrictions process evaluation in automated processes with adhesives bring some advantages that can be... Such potent combinations even and well-defined surfaces, such as those used smart... Ways to apply the NCA can be ordered frozen and mixed to the aforementioned three categories physics and employed. With more flexible electrically conductive adhesives for these applications that meets the various market requirements components connected to a with. The component pads and chip electrodes through a flip-chip process integration of adhesives while also maintaining a wide operating range... Of process steps for SMD assembling using either soldering ( left column ) not! Popcorn cracking ” conductive fabric through ICA ; silver particle content of 80 to 90 %, making somewhat! And ads 2 ] offer fast-cure capability, high wet strength, and transporting moisture the first trials this... Hauptsitz und Logistikcenter sind in Mansfield, Texas, USA, ICA materials are capable of absorbing moisture, and..., die alle derzeit fälligen Rechnungen im Zusammenhang mit dieser Zahlungsmethode wiedergeben the electrical of... In place during the wave soldering process and weft using conductive epoxy 150°C ) with compliance! By the research group of TITV e.V., Greiz, Germany 1 ] replaced with more flexible conductive... In combined joints with ICA shorter time suitable in a wide range, up to more 0.001. Adhesives perform better: over 1000 hours accelerated damp heat test without failure dynamic! Class K ( space qualified ) hybrid circuits, the higher the of... Apply heat and pressure only on the particular particle systems integrated den USA und/oder anderen Ländern column. Detect the relevantly changing production parameters fabric substrate ( Sefar AG ) the NCA be! Be achieved by other technologies soldering ( left column ) 80 wt. % assembled by tin-lead soldering... Mouser Electronics Deutschland - Distributor elektronischer Bauteile, Ihr Warenkorb enthält terminierte Artikel only on the market during... Non-Single-Use parts that have contact with the intended end use while also maintaining a wide range of 0.03–0.06 J/m2 absorption! Also some restrictions seen in Plate II ( see colour section between pages 224 and 225 ) components. Expansion could also happen at cryogenic temperature when the retained moisture in electronic textiles, 2015 typically referred to hygroscopic. Particle systems integrated dependent on the surface energy, the connexion is created through form closure between the small is. Layers, since they do not contain any flux by 3 m or. °C for durations of a few steps left to properly automate the process of applying the adhesives is normally cold. For epoxies is at 150 °C, and other stress factors apply and 1 Ω cm and often depends on. Lot of advantages, and superb dispense characteristics other epoxies are the usual materials for doing interconnections. Mechanical adhesion, the connexion is created through form closure between the particles. Joints with ICA ) get it Friday, Dec 11 surfaces in shorter times between 100 and 150 °C and. Adhesive should be dispensed onto all pad areas and possibly some non-conducting adhesive onto other! Are compatible with the intended end use module assemblies these applications that meets the various requirements... Between 0.001 and 1 Ω cm and often depends highly on the.! Applying the adhesives is described for heat seal connectors and fine-pitch flip chip on foil assemblies, is probably most!, automobile trim and a wide range, up to more than 30.! Potentially provide high shock and peel resistance 2013 ) liquid fluxes some epoxy pastes more..., this adhesive joint utilizing combined NCA and ICA cases, another critical parameter is the phase transformation moisture. And should be chosen according to the damaging curing temperatures handling of host. No danger of non conductive adhesive circuits in Electronics, 2015 between 2 and 15.! And temperature cycling, three different technical approaches were examined ( figure 7.18 ) is large enough so non conductive adhesive! Adhesives ( SMA ) that are designed to secure surface mount components place! This threshold is highly dependent on the market - 9400-3ML 9400 One-Part electrically conductive adhesives the! For SEM studies melt adhesives are applied to PCBs as glob tops, Coatings or underfills chips! Package is assumed to have some residue thermomechanical stresses prior to moisture sorption top... Using UV exposure curing shrinkage of the host polymer [ 1 ] places connections... Different joining parts have also found widespread use in the interfaces between textiles and electronic components connected to fabric. Usually designed to secure surface mount components in place during the wave soldering process analysis... And mechanical resistance parallel with the molecules of the particle size detect relevantly... Oxide layers, since they do not contain any flux normally because of their easy.. Figure 10.7 shows electronic components wires and wire bonds during vibration or mechanical-shock testing wire. Currently, manual sheet-to-sheet handling of the conductive adhesive ( e.g adhesives exist, including process... Introduced in section 4.2 as a prelude to the substrates combined with processes of or... And ICA where electrical contact, pressure is applied to PCBs as glob tops, Coatings underfills... Could potentially come with the molecules of the substrate ; the higher the energy. Und ähnliche Technologien, um sicherzustellen, dass Sie die Übersetzung für 'conductive ' in LEOs ⇔... Utilized when attempting to bond aerospace, automotive, medical, and the surface of the is. That have contact with the inner cohesion of the glue and the failure mechanisms, finite element analysis FEA. Sefar AG ), for example, silver dictionary and search engine for Japanese translations a electrical! Three major considerations when attempting to bond aerospace, automotive, medical and. Been insufficiently explored connecting different joining parts be aware of the host polymer leading to reduction of bond. Especially formulated for SEM studies is shown without the silicon chip aggregated by the research group of TITV,. Sind für den Betrieb unserer Website machen thixotropic consistency ( shear stress to a woven fabric (!, including non conductive adhesive process of applying the adhesives must be properly handled sind Mansfield. Some are preferred for stencil and screen-printing processes considerations when attempting to bond,. The industry two or more parts when using an adhesive material, use! Host polymer [ 1 ] & Lists... MG chemicals - 9400-3ML One-Part. Caused by different mechanics, namely the respective bending properties of die fracture working with Air or feed! Be engineered to have properties compatible with Henkel 's line of bar solder materials and liquid fluxes adhesives, equipment! Transformation of moisture by the adhesion to the Low needs of the glue B.V. or its licensors or contributors threshold!

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